About Epoxy Resins
Combined with curing agents, epoxy resins demonstrate superior bonding properties, corrosion resistance, and heat resistance, and they are widely used in the fields of coatings, electrical/electronics, civil engineering, construction, and adhesives.
DIC stocks a number of products, from general purpose types to specialized types, for these wide-ranging applications.
Major Applications
We introduce epoxy resins suitable for various applications such as FRP molding, floor coating, adhesives, coatings and encapsulants.
Hot Products
-EPICLON HP-6000 Super High Heat-Resistance/ Excellent flame-retardancy Epoxy Resin
High-performance epoxy resin that achieves both heat resistance and flame retardancy, which are in a contradictory relationship to each other. The volume change against temperature is also small; therefore, it is the most appropriate epoxy resin to IC sealing material and package substrate which will be increasingly thinner and smaller in the future.
-EPICLON HP-4710 Ultra-high Heat-resistant Epoxy Resin
EPICLON HP-4710 is a new epoxy resin developed for cutting-edge electrical component materials that demand excellent heat resistance and low thermal expansion.
-New EPICLON EXA-4850 Series Flexible Toughness Liquid Epoxy Resin
A new high performance liquid epoxy resin that fundamentally improves the hard, brittle properties that have been a quality problem of epoxy resins.
-EPICLON HPC-8000-65T Low-dielectric/ Hygroscopic Active Property Ester Resin
EPICLON HPC-8000-65T is a new epoxy curing agent developed for cutting-edge electrical component materials that demand excellent dielectric properties (low dielectric constant, low dissipation factor) and low hygroscopic properties.