Brazing MaterialsPhosphorus Copper Brazing Filler (BCuP)

Phosphorus Copper Brazing Filler (BCuP) is mainly used to bond the base material of copper and copper alloys and is also used for brazing Tungsten and Molybdenum. In the case of Phosphorus Copper Brazing Filler (BCuP), it is not necessary to use a separate FLUX because of phosphorus (P) that has self-fluxing properties. In addition to the standard Phosphorus Copper Brazing Filler (BCuP) specified by KS and JIS, YOOCHNAG METAL IND. is producing bar-type and ring-type of Phosphorus Copper Brazing Filler (BCuP) that reduces cost and supplements and improves material properties.

Phosphorus Copper Brazing Filler

YCM Code

KS & JIS

Component (%)

Working temperature (℃)

COSIL-1

BCuP-1

Ag : 0, P, Cu

785~925

COSIL-2

BCuP-2

Ag : 0, P, Cu

735~840

COSIL-3

BCuP-3

Ag : 4.7~6.3, P, Cu

705~840

COSIL-4

BCuP-4

Ag : 4.7~6.3, P, Cu

705~815

COSIL-5

BCuP-5

Ag : 14.5~15.5, P, Cu

705~840


Non-standard Phosphorus Copper Brazing Filler (BCuP)


YCM Code

Component (%)

Working temperature (℃)

COSIL-08

Ag : 0, P, Cu

710~830

COSIL-10

Ag : 1.0, P, Cu

705~840

COSIL-15

Ag : 1.5, P, Cu

705~840

COSIL-20

Ag : 2.0, P, Cu

705~840

COSIL-20D

Ag : 2.0, P, Cu

660~750

COSIL-30

Ag : 3.0, P, Cu

705~840

COSIL-200

Ag : 20, P, Cu

705~840


Phosphorus Copper Brazing Filler (BCuP) Ring


YCM Code

Component (%)

Working temperature (℃)

COSIL-20 Ring

Ag : 2.0, P, Cu

705~840

COSIL-30 Ring

Ag : 3.0, P, Cu

705~840