The sputtering target for manufacturing FCCL, the original material of FPCB, requires features such as high purity, high electrical conductivity, low impurity content, low oxygen concentration, and low hydrogen embrittlement. Particularly, high oxygen concentration causes pores in the sputtering film, causing serious defects. Our high-quality oxygen-free copper sputtering target has fewer substances that cause a decrease in electrical conductivity and has high electrical conductivity. And its oxygen concentration is less than 2.1ppm on average, pores are not generated, and hydrogen embrittlement hardly occurs, so it does not impair FCCL features.