Copper (Ⅱ) Oxide SS-CuO
FORMULA | CuO CAS NO. 1317-38-0 |
APPEARANCE | Black Powder |
USES | - Cu ion supplied upon electrolytic copper plating and copper sulfate plating (Via-Fill, Through Hole, PCBs and etc) - High-purity raw chemical used for manufacturing various types of copper salt - Electrolytic/Electroless copper plating - Vertical or horizontal plating method can be interchanged |
ADVANTAGE | - Domestic market share no.1 - Import substitution effect owing to the first development in Korea and successful commercialization - Reliability verified as used by large companies in Korea - Outstanding stability of plating thickness owing to the small amount of impurities - Extremely little residual chlorine and organic matters |
PACKING | 25KGS NET IN P.E BAG / 250KG 300KG PE DRUM / ETC |
SPECIFICATION
Item | Unit | Spec |
CuO | % | Min 97.0 |
Cu | % | Min 77.0 |
Fe | % | Max 0.005 |
Pb | % | Max 0.001 |
Cl | ppm | Max 0.001 |
Moisture | % | Max 0.35 |
Dissolution time in | Sec | Max 40 |