Imaging Process - Resist Stripping
DUAL STRIP BAT
- Highly effective resist stripping product for any liquid or dry film inner layer resist.
Strong anti-tarnish package to maximize productivity at AOI.
ULTRASTRIP BAT
- General purpose inner layer stripper. Low pH working solution. Excellent with flex.
ADF-35
- Formulated to remove fully aqueous dry films and screen ink resists from inner layers in spray applications.
ADF-35 will produce large particles for easy filtration, with less dissolved resist for prolonged bath life.
It contains antitarnish agents to maintain a bright uniform copper appearance.
It has very low levels of ingredients classified as VOCs, and when used as directed is exempt from SCAQMD regulation.
ADF-55
- Formulated to remove fully aqueous dry films and liquid resists in soak or spray applications.
ADF-55 breaks dry films into particles suitable for filtration and has a low VOC content for reduced air emissions.
ADF-55 contains special copper brightening and antitarnish agents that produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
ADF-281
- A specialized, fully aqueous photoresist stripper formulated to strip thicker resists, especially when used for tent and etch applications. ADF-281 provides fast strip speeds and produces filterable particles, and contains coppers brightening and antitarnish agents for automatic optical
DUAL STRIP
- Formulated to remove fully aqueous dry films and screen ink resists in soak or spray applications.
DUAL STRIP will generally break dry films into particles suitable for filtration.
DUAL STRIP has a low VOC content for reduced air emissions.
DX STRIP BAT
- Provides additional antitarnish protection while removing fully aqueous liquid photoresists in spray or soak applications.
DX STRIP BAT is also effective on aqueous dry film photoresists, and on a combination of liquid and dry film resists being stripped in the same process. It will generally break dry films into particles suitable for filtration.
DX STRIP BAT has a low VOC content for reduced air emissions.
MAGNUM RS-100
- An alkaline stripper for dry film photoresist which produces large filterable particles in both spray and soak, and can be replenished. MAGNUM RS-100 offers fast strip time and long solution life. It is compatible with metallic etch resists, including tin and tin/lead alloys. Due to the low pH of the working solution, MAGNUM RS-100 will not attack tin, tin/lead or copper surfaces under normal operating conditions.
ULTRASTRIP
- A highly concentrated, long lasting, high performance non-caustic stripper for removal of aqueous dry film photoresist.
It can be used on both inner and outer layers and produces large particles suitable for filteration.
ADF-25C
- A fully aqueous, highly concentrated stripper producing high speeds and small particles. Ideal for fine lines and spaces.
MICROSTRIP 2000
-High speed resist stripping product designed to remove the toughest adhering resists by creating very small particles.
Ideal for overplate conditions.
ADF-10 BAT
- Specially formulated to remove semi-and fully aqueous dry film and screen ink resists.
ADF-10 BAT will generally break dry films into very minute particles. It contains copper brightening agents for uniform, clean copper appearance. ADF-10 BAT contains additional copper brightening and antitarnish agents to preserve a bright copper surface for increased etching capability
FLEXSTRIP
- General purpose resist stripper for a broad range of photoresists. An aqueous photoresist stripper specifically formulated for flexible circuit stripping operations. FLEXSTRIP contains copper antitarnish agents providing a cleaner surface for subsequent flex material processing. FLEXSTRIP produces fast strip speeds while producing large particles suitable for filtration. It contains no glycol ether solvents for greater compatibility with flex materials and a safer working environment.
* BAT Package : Additional brigtheners and antitarnish ingredients for increased copper protection and a bright even surface for AOI.