Oxide
MAGNABOND CO-300
- Copper oxide process for producing a uniform brown or black oxide coating for innerlayer copper foil.
Produces excellent bonding characteristics.
LAYERBOND 2000 / LAYERBOND REPLENISHER
- An adhesion promoter for inner layer bonding and solder mask application.
LAYERBOND 2000 produces a unique surface topography that promotes bonding of dielectric and copper.
PREBOND
- An alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process.
PREPBOND provides complete surface preparation for this process, eliminating the need for a microetch.
It completely removes residues from resist stripping, and is extremely effective for removing handling soils and fingerprints.
For spray, flood and soak applications.