Copper Plating Process - Desmear / Etchback
MAGNUM GE-600
- A non-ammoniated glass etch for use in desmear or etchback applications.
MAGNUM K - 401 OXIDIZER
- Low cost potassium permanganate designed for desmear applications of conventional resins.
Maximizes surface topography for superior adhesion of electroless copper.
MAGNUM N - 501 OXIDIZER
- Concentrated sodium permanganate designed for desmear & etchback applications on high Tg resins.
Provides maximum surface topography for superior adhesion of electroless copper.
MAGNUM N-599
- Neutralizer for permanganate residues.
MAGNUM S-400
- Biodegradable, highly effective sensitizer for use prior to permanganate.
Ideal for desmear or etchback applications.