Metallization Prep
▶ CIRCUTEK A-778 :
Accelerator for modifying the activated surface to improve hole wall adhesion.
▶ CIRCUTEK C-777 :
Colloidal palladium activator to catalyze substrates for subsequent electroless copper plating.
▶ CIRCUTEK CC-710 :
Alkaline cleaner/conditioner designed to clean and condition the glass and resin for better electroless copper
coverage.
▶ CIRCUTEK C-904 :
Alkaline cleaner/conditioner with effective cleaning and clean rinsing characteristics.
▶ CIRCUTEK PD-776 :
Liquid pre-dip to neutralize the substrate and prevent water drag-in into the activator.
▶ CIRCUTEK PD-776 S :
Powdered version of the PD-776.
▶ CIRCUTEK CU-825 :
Copper colloidal catalyst.