Metallization Prep


▶ CIRCUTEK A-778 :
Accelerator for modifying the activated surface to improve hole wall adhesion.

 CIRCUTEK C-777 :
Colloidal palladium activator to catalyze substrates for subsequent electroless copper plating.

 CIRCUTEK CC-710 :
Alkaline cleaner/conditioner designed to clean and condition the glass and resin for better electroless copper
coverage.

 CIRCUTEK C-904  :
Alkaline cleaner/conditioner with effective cleaning and clean rinsing characteristics.

 CIRCUTEK PD-776 :
Liquid pre-dip to neutralize the substrate and prevent water drag-in into the activator.

 CIRCUTEK PD-776 S :
Powdered version of the PD-776.

 CIRCUTEK CU-825  :
Copper colloidal catalyst.