Electroless Copper Plating
▶ CIRCUTEK PC 701 :
Highly stable, quadrol based electroless copper designed to deposit 70-90 microinches in 30 minutes at 90-110°F. Produces a uniform electroless copper deposit with excellent resistance to subsequent processes.
▶ CIRCUTEK EC 1050 :
Highly stable, quadrol based thin deposition electroless copper designed to plate 25-50 microinches in 15-30 minutes at 75-90°F.