Pre-Plate
▶ POSICLEAN®C :
Non-etching, phosphoric based pattern plate cleaner for immersion applications.
Consistently provides extended bath life and removes all organic and inorganic soils prior to acid copper plating.
▶ POSICLEAN® B :
Hydrochloric based pattern plate cleaner for immersion applications.
Provides complete cleaning of organic and inorganic soils without excess copper attack.
▶ POSICLEAN®M :
Sulfuric based pattern plate cleaner for immersion applications.
Removes oxidation, tarnish and organic soils prior to pattern plating.
▶ CIRCUTEK AC-300 :
An acid solution formulated specifically to remove the chromate coating from copper-clad laminate prior to innerlayer cleaning and imaging, on oxide lines or in applications where the chromate coating must be removed prior to microetching.