Electrolytic Copper Plating
▶ CUBRITE PC-525 :
One part additive for bright acid copper electrolytic plating.
Resulting deposit provides superior thermal stress performance
▶ SOLDERPLATE SGR :
Preferred peptone based additive for use in both high throw and conventional tin lead electrolytic plating baths.
▶ CU BRITE CF-110 :
A matte acid copper plating additive formulated for plating baths with high throwing power resulting in excellent surface to hole thickness ratios in through-hole plating of printed circuit boards.
Based on economical copper sulfate and sulfuric acid, it is easy to make up, operate and control.
CuBrite CF-110 is a single grain refining agent that is added on an ampere hour basis and is not removed by circulation of the plating solution through a filter packed with carbon.
The addition agent reaction products and organic contamination can thus be removed on a continuous basis to assure excellent deposit ductility.
CuBrite CF-110 produces fine-grained, soft, matte deposits that insure good solderability, resist adhesion and etch characteristics.
▶ CU BRITE PC-520 :
An additive containing the carrier component of the brightener system for CuBrite PC-525 copper plating bath. CuBrite PC-520 can replenish the carrier component without excessive additions of brightener to maintain desired characteristics of the plated copper deposit. It can be used after carbon treatment of the plating bath, or whenever there is excessive drag-out of the plating solution.