Non-conductive Die Attach Adhesive for BOC (Board on Chip) Package
● Outline
- It is a die attach adhesive for BOC package and it can guarantee high reliability and outstanding workability.
● Appearance
- White or black color paste
● Main components
- Epoxy, Silicone
● Packaging
- 100cc (bottle), 170cc (Tube)
● Features
- Wide process margin
- Excellent adhesion
- Screen printing stability
- Low chip warpage
- Long work life
- Good reliability properties
- Less bleed out or bubble during printing process
● Cross section view of package and applied part
 Package.png "For BOC (Board on Chip) Package.png")
● Product information
- B-stage type adhesive : Epoxy type
Product | B-stage condition | Cure condition | Viscosity (cPs @ 5.0rpm) | TI |
Trubond B303 | 120℃ / 30min | 175℃ / 30min | 13,000 | 2.9 |
- A-stage type adhesive : Silicone type
Product | Cure Condition | Viscosity (cPs @ 2.5rpm) | TI |
Trubond AF8104 | 175℃ / 60min | 80,000 | 1.2 |
HE-STA-2 | 175℃ / 60min | 75,000 | 1.2 |