Electrically Conductive Die Attach Adhesive for Metal Lead Frame



● Outline

- It is one component conductive adhesive to attach die onto metal lead frame, featuring excellent quality to keep continuous performance without loss of adhesion strength and high reliability which correspond to the JEDEC Level.


● Appearance

- Gray color paste


● Main components

- Epoxy, Hybrid resin, Silver


● Packaging

- 5cc, 10cc, 30cc (syringe)


● Features

- Low moisture absorption

- Minimum resin bleed out

- Excellent adhesion

- Improved JEDEC performance

- Good workability

 



● Cross section view of package and applied part



● Product information

Product

Cure condition

Viscosity
(cPs @ 5rpm)

TI

Tg (℃)

Thermal conductivity (mW/K)

Application

Trubond A501

175℃ / 15min

10,000

4.5

42

1.2

TSOP, QFP

Trubond A505

175℃ / 15min

11,500

5.0

36

1.34

SOP, SOIC, TSOP

Trubond A506

175℃ / 30min

8,000

5.8

45

2.8

QFN, QFP

Trubond AP4200

175℃ / 15min

10,000

5.3

80

2.1

QFN, QFP

Trubond AP2500

175℃ / 15min
or
200℃ / 70sec

8,000

5.4

52

1.2

TSOP, QFN

Trutherm A853

175℃ / 30min

12,000

5.3

80

20

High thermal package