Die Attach Adhesive for Plastic Package

● Outline

- It is a one component conductive/non conductive adhesive to attach die onto plastic substrate, featuring excellent quality to keep continuous performance without loss of adhesion strength and high reliability which correspond to the JEDEC Level.

● Appearance

- White, red or gray paste

● Main components

- Epoxy, Hybrid resin, Silver, Silica

● Packaging

- 5cc, 10cc, 30cc (syringe)

● Features

- Low moisture absorption

- Minimum resin bleed out

- Excellent adhesion

- Improved JEDEC performance

- Good workability

● Cross section view of package and applied part