Adhesive for INGOT Mounting (Semiconductor, Solar Light and LED)
● Outline
- It is designed to provide a temporary bond of the ingot during the wafering process. It is removed from the sliced wafer easily in warm wafer.
● Appearance
- Red or green paste
● Main components
- Epoxy, Hybrid resin, Silica
● Packaging
- 0.8kg, 1.0kg(bottle)
● Features
- Excellent demounting property
- Good adhesion
- Extended pot life
- Good workability
● Product information
▶ For semiconductor and LED wafer
Classification | Trubond S302-J | Trubond S500-J | Trubond S351-J | |||
(A) | (B) | (A) | (B) | (A) | (B) | |
Application | Ingot bonding | Ingot beam bonding | Ingot beam bonding | |||
Appearance | Red | Light brown | Green | Yellow white | Black | Light brown |
Mixing ratio | 2 | 1 | 1 | 1 | 1 | 1 |
Viscosity | 20,000 | 16,000 | 50,000 | 60,000 | 70,000 | 40,000 |
TI | 2.0 | 5.0 | 1.4 | 1.5 | 2.4 | 4.5 |
Demounting conditions | 70~90℃ Water | 260℃ Hot plate | 260℃ Hot plate | |||
▶ For solar wafer
Classification | Trubond AH6302 | Trubond AH6500 | ||
(A) | (B) | (A) | (B) | |
Application | Ingot bonding | Ingot beam bonding | ||
Appearance | Red | Light brown | Green | Yellow white |
Mixing ratio | 2 | 1 | 1 | 1 |
Viscosity | 20,000 | 16,000 | 50,000 | 60,000 |
TI | 2.0 | 5.0 | 1.4 | 1.5 |
Demounting conditions | 70~90℃ Water | 260℃ Hot plate | ||