Etching Factor Additives HB-100EF Series
● What is Etching Factor Additives EF Series?
- The HB-EF series is to produce better etching properties in processing CUCL2.
Addition of HB-EF series help increasing high etching factor rate and maximizing the yield.
● Advantages
▶ Easy to apply in the production line
▶ Easy to maintain concentration
▶ Applicable to a wide range of chlorine concentration (0.5~1.5N)
▶ Improvement of uniformity
▶ Maximize yield
▶ Connectible with hwabaek CUCL2 RGB controller
● Comparison
● Test results
▶ HB-120EF
- Cu Thickness 20~35㎛ ; SSD module, PC Memory module, Mobile application
- Cu Thickness < 20㎛ ; BGA, Flipchip Package, FPCB
- Cu thickness less than15㎛ package
▶ HB-100EF
- Cu thickness more than 50㎛ network product
