Pd, Ion Colloid Catalyst
▶ Application
Copper materiel, PCB
▶ Characteristic
- Selectively adsorbing Pd on to Copper materiel pattern.
- Pd catalyst for PCB, general electroless nickel plating treatment.
▶ Explanatory
Liquid
▶ Application
Plastic, ABS, PC, etc.
▶ Characteristic
- Providing catalyst metal core(metal Pd : 1.2g/ℓ) for chemical plating on to non-conductor such as plastic.
- Pd catalyst for PCB, general electroless nickel plating treatment.
▶ Explanatory
Liquid
● MS SP-PD / MS SP-PD(H)
▶ Application
Plastic, ABS, PC, Fabric for EMI
▶ Characteristic
- Palldium catalyst for plastic and EMI
- By concentration, ODM production, supply available. Metal Pd 6.0g/ℓ, metal Pd 9.0g/ℓ producing.
▶ Explanatory
Liquid
● MS-C2300(colloid type)
▶ Application
Copper plating PCB/PTH
▶ Characteristic
- Sn/Pd colloid adsorption process-Making electroless Copper plating particle be adsorbed on the non-conductor.
- Keep acid concentration low to give minimum effect on the impact resistance surface.
- Designed to have high activating power for strong adsorption on to Epoxy Resin and Glass Fiber.
▶ Explanatory
Liquid
● MS-C3300(ion type)
▶ Application
Copper plating PCB/PTH
▶ Characteristic
- Adsorbing negative charged Palladium to the in-lay of the hole and copper surface which is positively charged by cation surface agent
Alkali catalyst System-easy control.
▶ Explanatory
Liquid