Underfill resin
Name | Application | Hardening condition (°C/min) | Flow | Coefficient of viscosity (@25°C,cps) | Tg(°C) | Filler Capacity(%) | Exposure hours | Others |
WE-1007 | CSP/BGA | 120/20 or 150/5 | high | 4,000 | 90 | 0 | 48 | Repaireble |
WF-1008 | CSP/BGA | 120/20 or 150/5 | very high | 3,500 | 85 | 0 | 48 | Repaireble |
WE-1100 | Flip Chip | 150/20 | high | 6,000 | 140 | 50 | 24 | . |
WE-1105 | Flip Chip | 150/10 | very high | 3,500 | 135 | 25 | 48 | . |
WE-1201 | FBGA | 160/60 | midiume | 5,500 | 150 | 80 | 72 | Low contraction |