Conductive Paste






Name
Application
Filler Type
Density(g/cc)
Coefficient of viscosity(@25°C,cps)
Hardening condition(°C/min.)
Modulus(MPa)
Adhesive capacity
Others
WE-4401
Chip Adhesive
Silver
3.5
7,000
175/15
3,500
80
Fast setting
WE-4405
Chip Adhesive
Silver
3.5
8,000
175/30
4,000
120
.
WE-4406
Chip Adhesive
Silver
3.4
9,500
175/60
2,900
40
.