Polyimide Adhesive Tape


- Consisting of a combination of heat resistant base and adhesive incorporating adhesive control technology, the tape can be used for various precesses involving electronic components and devices. Type with particularly superior heat resistance are available, and can be used for temporary fastening during heating, masking or protection/transport of film components.



● Feature


- Heat resistance SMT process

- Stable breakdown voltage

- Splicing & holding



● Specification


Product

Film

Adhesive

Thickness
(㎛)

Adhesion strength
(g/25mm)

KS-130

Polyimide

Silicone

65

650

KS-130AS

65

650

KS-130A

65

670

KS-130H

65

650

KS-130D

135

1200/1300



● Construction




 

● Equipment