Dicing Tape




- Dicing Tape is applied to prevent dust scattering, when wafer as semi-conduct background is sawed for discrete device. There are two kinds of general decompression type and ultraviolet curable type.

As chip size of semiconduct is larger and thickness becomes thinner with high density integration, dicing tape typed UV curable because we must prevent dust scattering of chips by powerful adhesive strength when process in dicing before UV Irradiation and we must prevent damage such as micro crack, etc to chips incurred by the reason why adhesive strength can be weak and easily be peeled off after UV irradiation when process in pick-up.

 



● Specification


Item

KS-HC170

KS-HC220

KS-TC145

KS-TC210

Structure &
Material

Base Film

Polyolefin

Polyolefin

PET

PET

Adhesive

Acrylic

Acrylic

Acrylic

Acrylic

Protective Film

PET

PET

PET

PET

Thickness
(㎛)

Total

B/F

170

150

220

200

145

125

210

190

Adh

20

20

20

20

Adhesion
(g/25mm)

Before UV

1100

1100

2500

2500

After UV

Less than 35

Less than 35

Less than 35

Less than 35

Application

Non-UV

UV

COB & COF

COB & COF



● Construction