Half Etchant
● Features and Benefits
- Etching additive for Sulfuric acid/Hydrogen peroxide
- Available from dipping and spray process
- High etch rate can be measured in a short time and low temperature
- Can make thickness of copper evenly and thinly
- Surface of copper is bright after etching process
- Waste water treatment easy to control
- Inhibition of hydrogen peroxide decomposition is superior
| list | SPEC | measurement | Result |
|---|---|---|---|---|
Etch Rate 2㎛ | Ra (nm) | 300nm이상 | 407.70nm | OK |
Etch Rate 3㎛ | Ra (nm) | 300nm이상 | 419.14nm | OK |
Etch Rate 5㎛ | Ra (nm) | 300nm이상 | 436.68nm | OK |
Etch Rate 10㎛ | Ra (nm) | 300nm이상 | 425.85nm | OK |
