ENEPIG
● WHY ENEPIG?
- Characteristic of Anti-Oxidation Barrier
→ Gives good Solder joint strength and Corrosion resistance
- Characteristic of Thermal Diffusion Barrier
→ Gives good Wire bonding strength
● Palladium (KG-1100)
.png "Palladium (KG-1100).png")
● Gold (KG-2200)
.png "Gold (KG-2200).png")
● Solder Joint Strength
● Poor soldering by corrosion on Ni surface
