Thermally silicone PAD & SHEET

● Features

- Thermally Conductive Pad is applied between heat generating components such as Power transistor, Diode and CPU and heat sink to conduct heat.

▶ STG-4015(1)

Thermal Conductivity : -2.0W/mk Thickness: 0.2 - 35mm (It can be changed by structure) Hardness(Shore 00): 10 - 80

▶ STG-3040

Thermal Conductivity : 2.5 - 4.0W/mk Thickness: 0.25 - 35mm (It can be changed by structure) Hardness(Shore 00): 20 - 80

▶ STG-5070

Thermal Conductivity : 4.5 - 7.0W/mk Thickness: 0,5 - 35mm (It can be changed by structure) Hardness(Shore 00): 50 - 80

● Product type (Standard)

● Option

- Reinforcement carrier: Non carrier / Fiberglass / Adhesive tape

- Product color: Dark gray/ Gray / Light gray / Yellow / Ivory/Pink/ and so on 

- Inherent Surface tack: Both side tack/Both side no tack / Single side Tack & other side no tack or Slip 

* The options can be partially limited by order volume or the own properties,

● Explanation

● Specifications

[STG-4015-***]