Processing Fluid for Silicon Cathode
- Inorganic material (silicon, quartz, sapphire, gallium / arsenic) cutting fluid is unlike the normal coolant fluid used in metal cutting machining that use wire sawing methods, SiC slurry maintains an excellent proper viscosity, phase separation and sedimentation prevention of the compressed material, depending on the type and characteristics, as there are many different kinds available.
● Product Name: SCF-728
- SCF-728 is a water based cutting fluid used to reduce friction during drilling of the silicon cathode process of semiconductor parts. This product assist in the reducing friction during drilling of the 0.5mm holes. The process starts with drilling a hole to 0.45mm using a Diamond Micro Drill, then continue etching process further of 0.05mm with use of acid. The main ingredients are amines and carboxylic acid salts. This product provides outstanding results in lubrication, wetting, under extreme pressure, as an anti corrosion and as a wetting effect for short term elimination of fine powder. Use this product diluted at 5~10% with ion exchange water.
▶ Physical characteristics
