Dicing Fluid for Semiconductor Wafer
- LUBE CLEAN provides increased penetration into the cutting surface, minimize abrasive friction between the rotating blade and wafer. It reduces debris accumulation in the blade area.
● Product name: LUBE CLEAN (MC-3000)
▶ Physical characteristics
▶ Characteristics
- When wafer sawing, LUBE CLEAN provides increased penetration into the cutting surface, minimize abrasive friction between the rotating blade and wafer. It reduces debris accumulation in the blade area.
Lowers debris accumulation and prevents heat generation when wafer sawing because of improved wetting of wafer surface and reduction of surface tension.
This product removes the debris factor of silicon and galvanic effect of the bond pad, while enhancing the electrochemical charge balance providing protection to the bond pad.
Makes it possible for fast removal of debris due to increase of acoustic strength.
Reduces debris re-adhesion due to low ionic strength.
All the debris is removed and cleaned from the entire process, reducing the movement of electromagnetic materials.
Reduces damage from the lowered ESD which is generated from the friction of the blade or wafer sawing.
Superior of cooling, lubricating and cleaning effect when wafer sawing 4ⅹ4mm∼15ⅹ15mm chip by blade.
Superior non-corrosive on the wafer pattern.
Economical due to low concentration dilution of Max 3000 for sawing and cleaning.
Due to newly designed and developed semi-conductors products, our LUBE CLEAN is developed and produced in accordance with the requirements of the customer.
