Conveyor UV Cleansing Machine
Product Info
This light cleaning technology which uses deep UV uses 185nm and 254nm UV and ozone which has been released by UV. UV/O2 cleaning technology does not use any chemicals and instead is an effective method of dry deaning. It has the benefit of not causing any damage to the substance receiving the treatment, and the technology is applicable in dlening surfaces such as semiconductor wafers and TFT frame glass surface.
UV/O2 cleaning is done under high temperature, is easy to maintain and is low costing in terms of operation, and it is very effective in lovw density pollution. Compared to presently available atmospheric pressure plasma eximer lamp, its expansion is easy, has low cost maintenance and can be applied to products ranging from small products to big products over 2000mm.
This equipment has been constructed to improve and clean organic materials and particles from surfaces which have not been removed from the wafer's wet cleaning process.
- A self mutual assistance system has been applied to effectively construct the equipment's ozone's light release and cooling.
- An individual control system was installed to maximize energy and work efficiency.
- APPLICATION
1. water permeability and reforming of glass surfaces
2. water permeability and reforming of metal surfaces
3. reforming of register surfaces
4, removal of residues from register development.
5. register washing
6. Annealing and reforming for oxidized film
7. production of oxidized film
Specification
* The above standard is the average-form standards, and products not listed above is manutactured only under demand oder.
* CS Center : 82-32-624-3880
Product Photo
