ELECTROLYTIC NICKEL / GOLD PLATING PROCESS
Introduces products using advanced surface treatment technology of MK Chem & Tech
TEMPERESIST Series
The TEMPERESIST series is used for high purity gold deposition for semiconductors with a purity of 99.99%. The deposited film exhibits excellent hardness (60-80HV) for wire bonding and excellent stability at high temperatures. In addition, the plating solution can be used for a long time using JPR 2001, a resin for removing metal impurities.
| Brand name | Au(g/Lt) | Temp(℃) | Current density | Hardness | Features |
|---|---|---|---|---|---|
| Temperesist - EX | 6 ~ 20 | 65 ~ 80 | 0.1 ~ 0.4 ASD | 60 ~ 80 HV | Soft gold product for general Au bonding. Proven results for BGA and CSP |
| Temperesist - FX | 4 ~ 8 | 60 ~ 70 | 0.2 ~ 1.0 ASD | 60 ~ 80 HV | High-speed plating formulation. Directly applicable to Cu surfaces. Proven results for FPC |
| Temperesist - GR | 4 ~ 8 | 60 ~ 70 | 0.1 ~ 0.4 ASD | 60 ~ 80 HV | Non-erosive to resist. Coreless PCBs |
| Temperesist - DX | 6 ~ 12 | 65 ~ 80 | 0.1 ~ 0.4 ASD | 60 ~ 80 HV | The best solder joint bond strength |
| Temperesist - EX3000 | 8 ~ 15 | 40 ~ 60 | 0.5 ~ 1.0 ASD | 60 ~ 80 HV | For bump plating on wafer |
| Temperesist - K-91H | 8 ~ 12 | 60 ~ 68 | 0.2 ~ 0.6 ASD | 70 ~ 90 HV | Low stress gold coating. For bump plating on wafer (Cyanide free) |
Surface morphology of Temperesist series (gold films on the copper)
OROBRIGHT Series
The OROBRIGHT series is an Au-Co alloy plating solution of excellent throwing power and abrasion resistance. It is suitable for the products such as connector, memory module and NAND Flash memory because of excellent anti-corrosion and low contact resistance
| Brand name | Au(g/Lt) | Temp(℃) | Current Density | Hardness | Features |
|---|---|---|---|---|---|
| Orobrignt - HS2 | 2 ~ 6 | 38 ~ 50 | 0.3 ~ 3.0 ASD | 180 ~ 210 HV | Au-Co alloy. High throwing power. Rack plating |
| Orobrignt - HS2J | 2 ~ 8 | 38 ~ 50 | 0.5 ~ 5.0 ASD | 180 ~ 210 HV | High deposition rate . Rack plating |
| Orobrignt - HS5 | 4 ~ 12 | 38 ~ 60 | 5.0 ~ 20 ASD | 180 ~ 210 HV | Au-Co alloy. Submerged jet plating and jet plating |
| Orobrignt - BAR7 | 8 ~ 15 | 50 ~ 65 | 10 ~ 50 ASD | 160 ~ 200 HV | Au-Co alloy. Jet plating with Ni barrier |
| Orobrignt - SA | 8 ~ 12 | 55 ~ 65 | 0.2 ~ 0.5 ASD | 120 ~ 160 HV | Hard gold plating solution available Au Bonding |