Back Grind Tape
Adhesive & Coating > Adhesion Tape > Adhesion Tape
Price |
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|---|---|
Model name |
Back Grind Tape |
Usage |
Protection of semiconductor circuits during the process of water backside grinding |
Base Material |
. |
Packaging Unit |
Inquiry about this product |
File Attachment |
KSPV-SPV224.xls |
81-3, Daemyeong-ri, Daegot-myeon, Gimpo-si, Gyeonggi-do Kosasn Technology Material Ltd.
Detailed description
| Model name | Back Grind Tape | Usage | Protection of semiconductor circuits during the process of water backside grinding |
|---|---|---|---|
| Base Material | . | Packaging Unit | Inquiry about this product |
Company Profile
| Company name | KOSAN TECHNOLOGY MATERIAL | Business Owner | Son Byeong-kwon |
|---|---|---|---|
| Telephone | +82-31-983-5791 | Fax | +82-31-983-5641 |